Communication Device

· High Speed (Low Dk,Low Df)

· High Frequency (Low Dk,Low Df)

· High Precision

· High Reliability

Application: Wireless communication, Aeronautics & Astronautics, Medical equipment RF ID, Intelligent car

Computer and Peripherals

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Micro-via or Back Drill

· Backplane Design

Application: Computer, Server, Notebook, Toll Collection System, Ethernet Switch

Rail Transit

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Heavy Copper

· Backplane Design

Application: Metro,High-Speed Train

Vehicle Electronics

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Heavy Copper

· Immersion Silver or Tin

Application: New Power Car, Charging pile, Automobile

Medical Electronics

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Heavy Copper

· Immersion Silver or Tin

Application: Home Health Equipment, Home Medical Rehabilitation Equipment, Medical Equipment

Industrial Control

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Heavy Copper

· Immersion Silver or Tin

Application: Numerically-controlled Machine, Programmable Controller, Industrial Process Control, PLC,DCS, Embedded Computer

Semiconductor Integrated Circuit

· High Speed (Low Dk,Low Df)

· High Density

· Multi-layers

· Small and Thin

· Small Trace and Spacing (15um/15um)

· Special Material (ABF , BT)

· Advanced Footprint (BGA ,CSP, FC-CSP)

Application: Semiconductor Test PCB, IC-substrate

Education

· High Density

· Multi-layers

· Cost-effective

Application: Electronic Dictionary, Mobile watch, Translation Pen, Tablet PC

Consumer Electronics

· 2 layers to 10 layers

· Optimized layout

· Cost-effective

Application: Access Control System, Intelligent home Application, Phone, Wearable Electronics