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FC-CSP

FC-CSP - FC-CSP IC Sub-strate

FC-CSP IC Sub-strate

Features

High pin count and short electrical interconnection distances

High Density Imposition

Arrayed lead-free solder ball bumps and copper pillar bumps

Lamination technology and stacked hole structure

Precision trace technology
Specification

Package Size: 3 x 3 mm up to 15 x 15 mm

Line & Space 15/15 um

Bump Pitch down to 100 um

ETS, Coreless available
Application

Smartphones

· High density interconnection

· Small size and thin thickness

· Suitable for various small-sized mobile phones

· 4G, 5G

· Wireless Bluetooth, NFC

Tablets

· High density interconnection

· Small size and thin thickness

· Suitable for tablets of various sizes

Laptop computer

· High density interconnection

· Small size and thin thickness

· Highly integrated

· Small line width line spacing

AI Artificial Intelligence

· High density interconnection

· Small size and thin thickness

· Highly integrated

· Small line width line spacing