PCB DESIGN

• High-Speed Memory Interface Design [• DDR3 and LPDDR4 SDRAM Implementations; • SRAM Interfaces; •SD Card & eMMC Interfaces]

• FPGA Hardware Development [• Experience with Rad-Hard and Flight Rated Hardware Development ]

• Microcontroller Hardware Development [•ARM Cortex M0-M7 & Newer TrustZone enabled ARM cores; •Analogous MIPS cores]

• Application Class Processor (MPU) Hardware Development [•ARM A7, A8, A15 and newer CPU; •Single Board Computer Design w/ TI’s Sitara ]

• Video and Display Hardware [•Parallel RGB TFT Interfaces;  •MIPI-DSI; • EMI & EMC Mitigation for Touch Screen Interfaces]

• Implementation of FPGA & ASIC Based Display Bridges [•Inline Translation Between MIPI DSI and legacy parallel RBG Video ]

• Motherboard Development for Modern SoM’s such as Xilinx Kria and NVIDIA Jetson/Xavier

• USB 2.0, USB 3.0, & Gigabit Ethernet Hardware, Including Switches/Hubs

• FPGA Hardware Development

• PCIe Hardware

• Electro-optical Interface Design [• Transimpedance Amplifiers; • Laser & Pump Diode Drivers]

• Ultrasonic & Piezoelectric Drive Amplifier Design [•Including amps for other capacitive transducers, hydrophones, etc. ]

• Audio Amplifier Design 

• Analog Filter Design [•High-Order Lumped Element Filters;  •Absorptive Filter Design; •Distributed Microstrip Filter Design]

• High speed ADC & DAC Implementations

• Direct-RF Sampling Architectures [•Experience with Simultaneous Tx/Rx Front Ends up to 2Gbps ]

• Up/down Converting Mixers & IF Signal Processing

• Analog Signal Processing & General Purpose Op-Amp Circuits

• High Performance Switchmode Converter Design 

• Ultra Low Noise Converter Design for RF Supply Pre-Regulation [•Slew rate controlled switching ]

• EMI/EMC Converter Debugging

• Input Filter Design

• High Frequency Converters for Micro Form Factors

• Hotswap Control

• Automotive/Aerospace Load Dump Protection

• Battery Systems [•Multi-Chemistry Charge Controllers;  •Battery Protection Systems;  • Fuel Gauge & SoC/SoH Monitoring ]

• Altium Designer • Cadence Allegro • Mentor Graphics pads

• High Density Interconnect (HDI) Board Design [•Blind/Buried Vias;  •Laser Driller Microvias ]

• Flex PCB Design

• High Power & High Voltage Board layout [•HV Creepage Requirements;  •HV Isolation Routing]

• Integrated Flex/Rigid Multi-Board Assemblies

• Concurrent Multi-Board 3D modeling for low-clearance daughter board mating [•FPGA Mezzanine Cards;  • SDRAM SODIMM Cards]

• High Frequency PCB Design [•RF & Microwave distributed structures (couplers, filters, matching networks, etc.); ]

• Waveguide transition design [•High-frequency edge-launch to planar waveguide transitions;  •Microstrip to stripline transitions;  •High-frequency through board microstrip-to-microstrip transitions ]

• High Frequency PCB Design [•RF & Microwave distributed structures (couplers, filters, matching networks, etc.); ]

• High speed Digital Interface Layout [•Controlled impedance; •Skew / Group-Delay Tuning;  •Highspeed Differential Routing  ]

• DDR3 & DDR4/LPDDR4 SDRAM Interfaces, PCIe, USB 3.0, Display Port, MIPI-CSI & MIPI-DSI

• Commercial Airline Telephones

• Microstrip and Stripline Circuits

• Millimeter Wave Applications

• Military Radar Systems

• Missile Guidance Systems

• Point to Point Digital Radio Antennas