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sales@kingtontech.com*Light and thin, helping reducing the size and weight of electronic products
*High wiring density
*Free bending, winding, and folding
*High flexibility
*Excellent heat dissipation
*Excellent solderability
| Layer | 1-8 |
| The Width/Length | Width:450mm , Length 800mm |
| Line Width/Space | Inner : 3/3mil, Outer : 3/3mil |
| Minimum Drilling Diameter | 0.10mm(Mechanical Dilling), 0.075-0.1mm(Laser Driling) |
| Minimum Ring Width | 4mil |
| Board thickness | 0.08-0.5mm |
| Finished Copper (max) | Inner : 2 OZ, Outer : 2 OZ |
| Dimension Accuracy | +/-0.10mm(specially 士0.05mm) |
| Surface Processing Method | ENIG、ENEPIG、OSP |
· Metal substrate
· High thermal conductivity
· Heat dissipation holes, high power
· PI substrate
· Small size and light weight
· Comply with aerial installation specifications
· Obtaining long-term recognition from multiple medical clients
· Small size, fine PCB to meet the needs of portable products
· High reliability PCB product quality control
· Meet the technological research and development of new energy vehicles
· Strictly follow the IATF 16949 management system for operation