CSP
CSP

CSP

  • Features

    High density build-up structure

    Via fill plating & stack via available

    Multiple surface finish

    Thin and flat board

    Precision trace technology

  • Specification

    Package Size: 3 x 3mm up to 19 x 19 mm

    Thickness: 90um for MP, 80um under development

    Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm

    Fine line/space : MSAP 20/20um

    Coreless available

    Material: BT HL832-NXA

    Min Trace/Spacing: 120/25um

    Layers: 2layers Surface: ENEPIG Thickness: 0.25mm

  • Application
    Industrial product

    · Industrial equipment

    · Measuring equipment

    · Power equipment

    Automotive Products

    · High reliability PCB product quality control

    · Meet the technological research and development of new energy vehicles

    · Strictly follow the IATF 16949 management system for operation

    Medical Products

    · Obtaining long-term recognition from multiple medical clients

    · Small size, fine PCB to meet the needs of portable products

    Communication products

    · High and multi-layer production capability

    · Accurate impedance control

    · Large size, thick backboard production

    · Various special materials and mixed media

    · Special craft: long and short gold fingers, back drill

    Smartphones

    · High density interconnection

    · Small size and thin thickness

    · Suitable for various small-sized mobile phones

    · 4G, 5G

    · Wireless Bluetooth, NFC

    Tablets

    · High density interconnection

    · Small size and thin thickness

    · Suitable for tablets of various sizes

    Notebook computer

    · LAPTOP COMPUTER

    · High density interconnection

    · Small size and thin thickness

    · Highly integrated

    · Small line width line spacing

    AI Artificial Intelligence

    · High density interconnection

    · Small size and thin thickness

    · Highly integrated

    · Small line width line spacing