Mail Us
sales@kingtontech.comHigh density build-up structure
Via fill plating & stack via available
Multiple surface finish
Thin and flat board
Precision trace technology
Package Size: 3 x 3mm up to 19 x 19 mm
Thickness: 90um for MP, 80um under development
Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
Fine line/space : MSAP 20/20um
Coreless available
Material: BT HL832-NXA
Min Trace/Spacing: 120/25um
Layers: 2layers Surface: ENEPIG Thickness: 0.25mm
· Industrial equipment
· Measuring equipment
· Power equipment
· High reliability PCB product quality control
· Meet the technological research and development of new energy vehicles
· Strictly follow the IATF 16949 management system for operation
· Obtaining long-term recognition from multiple medical clients
· Small size, fine PCB to meet the needs of portable products
· High and multi-layer production capability
· Accurate impedance control
· Large size, thick backboard production
· Various special materials and mixed media
· Special craft: long and short gold fingers, back drill
· High density interconnection
· Small size and thin thickness
· Suitable for various small-sized mobile phones
· 4G, 5G
· Wireless Bluetooth, NFC
· High density interconnection
· Small size and thin thickness
· Suitable for tablets of various sizes
· LAPTOP COMPUTER
· High density interconnection
· Small size and thin thickness
· Highly integrated
· Small line width line spacing
· High density interconnection
· Small size and thin thickness
· Highly integrated
· Small line width line spacing