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RO4000® Series
• Lower insertion loss
• Low PIM
• Increased signal integrity
• High circuit density
• Ease of fabrication
Low Z-axis coefficient of thermal expansion
• MLB capability
• Design flexibility
Lead-free process compatible
• High temperature processing
• Ease of fabrication
• Meets environmental concerns
RT/duroid® 5870 /5880 Series High Frequency Laminates
• Lowest electrical loss for reinforced PTFE material
• Low moisture absorption
• Isotropic
• Uniform electrical properties over frequency
• Excellent chemical resistance
| Layer | 2-30 |
| The Width/Length | Width:450mm , Length 900mm |
| Line Width/Space | Inner : 3/3mil, Outer : 3/3mil |
| Minimum Drilling Diameter | 0.10mm(Mechanical Dilling), 0.075-0.1mm(Laser Driling) |
| Minimum Ring Width | 4mil |
| Board thickness | 0.1-10mm |
| Finished Copper | Inner : 8 OZ, Outer : 10 OZ |
| Spacing Between Hole And Conductor | Layer≤6: 5mil, 7≤Layer≤11: 6mil, Layer≥12: 8mil |
| Plate Thickness And Aperture Ratio | 1:1 (Blind Via); 16:1(Through Via) |
| Dimension Accuracy | +/-0.10mm(specially 士0.05mm) |
| Surface Processing Method | ENIG、ENEPIG、 HASL、FLASH GOLD、HARD GOLD、OSP |
• Commercial Airline Telephones
• Microstrip and Stripline Circuits
• Millimeter Wave Applications
• Military Radar Systems
• Missile Guidance Systems
• Point to Point Digital Radio Antennas
· Industrial equipment
· Measuring equipment
· Power equipment
·High and multi-layer production capability
·Accurate impedance control
·Large size, thick backboard production
·Various special materials and mixed media
·Special craft: long and short gold fingers, back drill
· Obtaining long-term recognition from multiple medical clients
· Small size, fine PCB to meet the needs of portable products
· High reliability PCB product quality control
· Meet the technological research and development of new energy vehicles
· Strictly follow the IATF 16949 management system for operation
