Mail Us
sales@kingtontech.com
*Free bending and flex resistance
*Weight Reduction
*High reliability
*3D Mounting
* Small size, small spacing to assemble
| Layer | 2-20 |
| The Width/Length | Width:450mm , Length 600mm |
| Line Width/Space | Inner : 3/3mil, Outer : 3/3mil |
| Minimum Drilling Diameter | 0.10mm(Mechanical Dilling), 0.075-0.1mm(Laser Driling) |
| Minimum Ring Width | 4mil |
| Board thickness | 0.2-10mm |
| Finished Copper | Inner : 3 OZ, Outer : 3 OZ |
| Spacing Between Hole And Conductor | Layer≤6: 5mil, 7≤Layer≤11: 6mil, Layer≥12: 8mil |
| Plate Thickness And Aperture Ratio | 1:1 (Blind Via); 16:1(Through Via) |
| Dimension Accuracy | +/-0.10mm(specially 士0.05mm) |
| Surface Processing Method | ENIG、ENEPIG、OSP |
· LAPTOP COMPUTER
· High density interconnection
· Small size and thin thickness
· Highly integrated
· Small line width line spacing
· High and multi-layer production capability
· Accurate impedance control
· Large size, thick backboard production
· Various special materials and mixed media
· Special craft: long and short gold fingers, back drill
· Obtaining long-term recognition from multiple medical clients
· Small size, fine PCB to meet the needs of portable products
· High reliability PCB product quality control
· Meet the technological research and development of new energy vehicles
· Strictly follow the IATF 16949 management system for operation
