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8 Layers laser drill Rigid-Flex PCB

8 Layers laser drill Rigid-Flex PCB

Brief

8-layers Flex-Rigid PCB Min. line width/space : 0.1/0.1mm Min hole: 0.2mm for mechanical, 0.1mm for laser Board thickness : 1.6mm Finished surface: Immersion gold Material: Polyimide(PI) and FR-4 Impedance: 50 ohm for rigid board , 100 ohm for rigid board Layer: 6 layers for rigid board, 2 layers for Flex Type: HDI , L1-L2 laser drill by 0.1mm, VIA ON PAD technology, 0.4mm pitch Application: Industry production

Description




8-layers Flex-Rigid PCB

Min. line width/space : 0.1/0.1mm

Min hole: 0.2mm for mechanical, 0.1mm for  laser

Board thickness : 1.6mm

Finished surface: Immersion gold

Material: Polyimide(PI) and FR-4

Impedance: 50 ohm for rigid board , 100 ohm for rigid board

Layer: 6 layers for rigid board, 2 layers for Flex

Type: HDI ,  L1-L2 laser drill by 0.1mm, VIA ON PAD technology, 0.4mm pitch

Application: Industry production


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