pcb design
Finished Surface
Location: Home > Finished Surface

Available surfaces
Surface
Thickness Shelf life Reflow cycles
HASL SnPb >5µm ca.12 months 5
HASL lead-free 1-40um ca. 12 months 5
Chemical tin >1µm ca. 6 months 5
Chemical silver 0.2 - 0.3µm ca.12 months 5
Chemical gold 3-6µm Ni ca. 12 months 5
ENIG 0.05-0.1µm Au
Galvanic softgold 4 - 6µm Ni ca. 12 months -
>1µm Au
OSP 0.2 - 0.3µm ca. 6 months 2




HAL SnPb HASL WITH LEAD

HAL SnPb (lead-tin) is nowadays allowed only in certain technology fields such as

medicine and space travel. HAL is suitable for standard SMD, but shows

weaknesses in fine pitch applications. A chemical surface is preferable for

finepitch (see also HAL vs.  chemical gold).

Advantages:                                       Disadvantages:
*Good solderability *Pads are non-planar
*Good reflow properties *Not RoHS-compliant
 




HAL lead-free  HASL LEAD FREE

HAL (Hot Air Levelling) is a well-proven method to apply tin as circuit

board surface. Every assembler should be able to process circuit

boards with HAL surfaces without any problem. HAL is suitable for standard SMD, but exhibits some weaknesses for finepitch   applications, for which a chemical

surface should be preferred (see also HAL vs.  immersion gold).

Advantages: Disadvantages:
*Good solderability *Pads are non-planar
*Good reflow properties



Chemical tin  IMMERSION TIN

The surface chemical tin is for manufacturing reasons rarely requested any more!

Due to the rapid oxidation of the copper, the shelf life is highly dependent on

temperature and packaging. Fingerprints on the surface should be avoided at all.

Advantages: Disadvantages:
*Absolutely flat *Extra charge
*Good for fine pitch *Critical manufacturing process
*Good for SMD *Faster oxidation, thus:
*Good for press-fit *Limited storability



Chemical silver   immserion silver

This circuit board surface is very similar to chemical tin, with better

properties for oxidation and contact applications. The surface is very

flat and therefore suited very well for finepitch.

Advantages: Disadvantages:
*Absolutely flat *Extra charge
*Good for fine pitch *Better use: chemical gold
*Good for SMD
*Good for press-fit
*Better shelf life than chemical tin





Chemical gold (ENIG)   immersion gold

Just as with chemical tin and chemical silver, chemical gold is an extremely flat

circuit board surface, and has very good oxidation properties. It is perfectly

suited for finepitch and bonding (aluminium wire) applications. Due to popular

demand, Multi-CB can offer chemical gold in pooling service (cheaper price). Chemical gold is also called ENIG

(Electroless Nickel Immersion Gold).

Advantages: Disadvantages:
*Absolutely flat *Possible extra charge
*Very good for fine pitch
*Very good for SMD
*Good wetting characteristics
*Good for press-fit
*Good storability
*Available in Pool-Service



If you have any question or inquiry , please send email to sales@kingtontech.com


TALK

dillonzhen77

TALK

+8618689485007